Size: 40 to 50 um diamond micron powder
Characteristic：Thermal conductivity of synthetic diamond powder
The first thing to know is that diamond is reputed to be the hardest substance in the world. It not only has special physical, mechanical, and optical properties but also has excellent thermal conductivity. Since diamond relies on phonons for heat transfer, in general, the lower the nitrogen content in diamond, the higher the thermal conductivity, the more complete the crystal form, and the higher the thermal conductivity.
With such excellent thermal conductivity, diamond powder has been used in the electronics industry for a long time and can well meet the ultra-high requirements of thermal management.
There are two main forms of its application, one is diamond film; the other is the diamond composite material made of diamond and copper, aluminum, and other metals.
At present, there is a new technology used to prepare diamond powder particles with a diameter of 40-50 um into a gel-type thermally conductive material, which can replace some of the ordinary thermally conductive gels in the original mobile phone to solve the heat dissipation problem of mobile phone chips.
Diamond is the material with the highest thermal conductivity in nature, which can reach more than 2000w/MK. In terms of heat dissipation of high-power optoelectronic devices, it is obvious that it is generally used in the core thermal management elements of new spacecraft.
The diamond heat-dissipating gel made of diamond micro powder allows the chip to quickly transfer heat and achieve rapid cooling. The heat dissipation performance is 50-60% higher than that of conventional gels, and the CPU core problem can be reduced by up to 18 degrees Celsius.
With such excellent thermal conductivity, diamond powder has been used in the electronics industry for a long time and can well meet the ultra-high requirements of thermal management.
There are two main forms of its application, one is diamond film; the other is the diamond composite material made of diamond and copper, aluminum, and other metals.
At present, there is a new technology used to prepare diamond powder particles with a diameter of 40-50 um into a gel-type thermally conductive material, which can replace some of the ordinary thermally conductive gels in the original mobile phone to solve the heat dissipation problem of mobile phone chips.
Diamond is the material with the highest thermal conductivity in nature, which can reach more than 2000w/MK. In terms of heat dissipation of high-power optoelectronic devices, it is obvious that it is generally used in the core thermal management elements of new spacecraft.
The diamond heat-dissipating gel made of diamond micro powder allows the chip to quickly transfer heat and achieve rapid cooling. The heat dissipation performance is 50-60% higher than that of conventional gels, and the CPU core problem can be reduced by up to 18 degrees Celsius.
